Products
- Protective Film
- Double Sided Tape
- Decoration
- EMI Shielding & Heat Dissipation Films
- Aerogel
- Wireless Charging
- Wafer
- PCB/FPC
- Conductive
5I35S QFN Carrier Tape
Features
● High-precision coating, the coating thickness is uniform.
● With PI substrate and silicone, high temperature resistance.
● Attach or tear film without preheating.
● After tearing the film, no residue.
Structure
|
Adhesive |
Total Thickness(mm) |
Release Film(mm) |
Width (mm) |
|
Silicon |
0.035 |
0.075 |
72mm * 100M |
Applications
● Prevents resin leakage when molding semiconductor packages or electronic components.
● It plays a role in temporary fixing, shielding, protection and transportation of parts in the heating process.
Properties
|
Test Items |
Test Value |
Test Method |
|
|
Substrate Thickness |
mm |
0.025 |
Thickness Gauge |
|
Silicon Thickness |
mm |
0.01 |
|
|
Adhesion (g/50mm) |
SUS 304 |
150 |
JISZ0237 8 |
|
Copper |
152 |
||
|
Ni/Pd/Au |
142 |
||
聯(lián)系方式：1360-265-7431
地址：深圳市南山區(qū)蘭香一街海王星辰總部大廈1607
