Products
- Protective Film
- Double Sided Tape
- Decoration
- EMI Shielding & Heat Dissipation Films
- Aerogel
- Wireless Charging
- Wafer
- PCB/FPC
- Conductive
5P120A Back Grinding Tape
Features
● With a high coverage of the circuit surface, it prevents scattering of the wafers and the infiltration of grinding water during polishing.
● Highly clean and extremely low ion impurities.
● Moderate hardness, effective absorption of vibration and stress and reducing fragmentation.
● With excellent thickness uniformity.
Structure
|
Adhesive |
Total Thickness(mm) |
Release Film(mm) |
SPEC |
|
Acrylic |
0.12 |
0.05 |
8" 230mm * 100M |
|
12" 330mm *100M |
Applications
● Protective tape used in wafer backside polishing process.
Properties
|
Test Items |
Value |
Test Method |
|
|
Adhesion to Steel (g/25mm) |
100±20 |
JISZ0237 8 |
|
|
Peel Strength(g/25mm) |
<10 |
||
|
Temperature(℃) |
-10~120 |
Thermometer |
|
|
Transmittance(%) |
85±10 |
ASTM D1003 |
|
|
Elongation(%) |
MD |
>650 |
ASTM-D638 |
|
TD |
>550 |
||
聯(lián)系方式：1360-265-7431
地址：深圳市南山區(qū)蘭香一街海王星辰總部大廈1607
