Products
- Protective Film
- Double Sided Tape
- Decoration
- EMI Shielding & Heat Dissipation Films
- Aerogel
- Wireless Charging
- Wafer
- PCB/FPC
- Conductive
5T85A Tearing Tape
Features
● After UV irradiation, no adhesive residue after tearing tape.
● Modertate viscosity, no residue.
● When tearing the membrane, the noise is low and does not affect the surrounding production environment.
● Uniform coating, strong tensile strength.
Structure
Adhesive |
Total Thickness(mm) |
SPEC |
Acrylic |
0.085 |
8" 50mm * 100M |
12" 75mm *100M |
Applications
● Peel off the back grinding tape of silicon wafer for semiconductor manufacturing process.
Properties
Test Items |
Value |
Test Method |
Adhesion (g/25mm) |
2100±300 |
JISZ0237 8 |