Products
- Protective Film
- Double Sided Tape
- Decoration
- EMI Shielding & Heat Dissipation Films
- Aerogel
- Wireless Charging
- Wafer
- PCB/FPC
- Conductive
H7510M 80 μm Heat Resistant Carrier Tape
Features
● High temperature resistance, low shrinkage, acid and alkali resistance.
● Easy to strip, free from contamination and without residual glue.
● Easy to attach, no bubbles. It is stable after attaching.
Structure
|
Adhesive |
Total Thickness(mm) |
Release Film(mm) |
Width (mm) |
|
Acrylic |
0.08 |
0.025 |
Max 1000 |
Applications
● For FPC high temperature process, acid and alkali process, no crimp, no residual glue.
● For ITO glass, high temperature protection, no residual glue.
Properties
|
Test Items |
Test Value |
Test Method |
|
|
Adhesion to Steel (g/25mm) |
7 |
JISZ0237 8 |
|
|
Initial Tack J.DOW (0~32#) |
<3# |
JISZ0237 12 |
|
|
Shrinkage(180℃,30min) |
MD |
< 0.5 |
Thermal Shrinkage Tester |
|
TD |
< 0.1 |
||
聯(lián)系方式：1360-265-7431
地址：深圳市南山區(qū)蘭香一街海王星辰總部大廈1607
